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搜索结果列表 共搜到关于 W-870 的物性记录约 20＋条,本页只展示最多20条记录
AES+PC|W-870|Nippon A&L Inc.
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TECHNIACE® W-870是一种丙烯腈乙烯苯乙烯 + PC (AES+PC)材料。该产品在北美洲或亚太地区有供货,加工方式为:注射成型。
AES|W-870|日本住友诺格
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PC/ABS|W-870|日本诺格达克
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耐候性和耐热性
TPV|VP-870|DIOSHY Co.,Ltd.
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DIOSHY® VP-870是一种热塑性硫化橡胶(TPV)材料。该产品在亚太地区有供货。
氟橡胶|870|Greene, Tweed & Co.
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Xyfluor® 870, a highly fluorinated elastomer compound, offers excellent chemical compatibility over a wide range of temperatures from -76°F to 450°F (-60°C to 232°C). Recommended for applications requiring a combination of low temperature properties and chemical resistance, Xyfluor 870 reduces overa...more.
TP，未指定|870|Hapco Inc.
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HAPFLEX 700 & 800 products are a series of low hazard, colorless, high strength, elastomers available in Shore hardnesses from 65A to 72D. HAPFLEX 700 & 800 products exhibit high tensile strength, high tear strength, and excellent elongation. All HAPFLEX 700 & 800 products cure at room temperature a...more.
ABS|ABS 870|舒尔曼塑料
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耐冲击性，良好的韧性
环氧|KYOCERA KE-870|KYOCERA Chemical Corporation
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Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.Strong Points Application
TP，未指定|870-4|Hapco Inc.
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HAPFLEX 700 & 800 products are a series of low hazard, colorless, high strength, elastomers available in Shore hardnesses from 65A to 72D. HAPFLEX 700 & 800 products exhibit high tensile strength, high tear strength, and excellent elongation. All HAPFLEX 700 & 800 products cure at room temperature a...more.
环氧|Plaskon CMU-870-2C|Cookson Electronics - Semiconductor Products
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This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Highe...more.
硅酮 (Silicone)|SC 870 A/B|Wacker Chemie AG
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RTV-2 SILICONE FOAMELASTOSIL® SC 870 A/B is a thixotropic, addition-curing, two-part silicone rubber, forming a mainly closed cell foam.Special features Application
环氧|Plaskon CMU-870-2A|Cookson Electronics - Semiconductor Products
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This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Highe...more.
PP均聚物|PH-870|DAELIM INDUSTRIAL CO., LTD.
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Daelim Po1y® PH-870是一种聚丙烯均聚物(PP Homopoly)产品。它在欧洲或亚太地区有供货。
环氧|Plaskon CMU-870-2B|Cookson Electronics - Semiconductor Products
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备注说明：
This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Highe...more.
