环氧/Epoxies, Ect. 20-3035 (Cat.30)/Epoxies, Etc. 物性表
环氧/Epoxies, Ect. 20-3035 (Cat.30)/Epoxies, Etc.
规格用途
| 该料用途 | 电气/电子应用领域 |
| 备注说明 | 20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds.20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.Features: |
技术参数
| 性能项目 | 测试条件 | 测试方法 | 数值/描述 | 单位 | |
| Uncured Properties | Mix Ratio by Weight (PBW) | Part A | 떖낑낑 | Part B | Ꚃ떖 | 密度 | 25°C | 낑.Ꚃ | g/cm³ | 粘度 | 25°C | ꠕ | Pa·s | 固化时间 | 100°C | Ꚃ.낑 到 젡.낑 | hr | 85°C | 젡.낑 到 .낑 | hr | 储存稳定性 | 25°C | Ꚃ낑 | min |
| Cured Properties | 吸水率 4 | 낑.낑ꠕ낑 | % | 支撐硬度 | Shore D | Ꚃ | 抗张强度 | 젡젡.떖 | MPa | 压缩强度 | Ꚃ.쐕 | MPa | 耐电强度 | 떖ꠕ | kV/mm | 相对电容率 | 1 MHz | Ꚃ.쐕젡 | 体积电阻率 | 25°C | > 떖.낑Ꚕ+떖젡 | ohms·cm | 耗散因数 | 1 MHz | 낑.낑ꠕ낑 |
| 物理性能 | 收缩率 - 流动 | 낑.Ꚃ낑 | % | ||
| 热性能 | 线形热膨胀系数 - 流动 | .낑Ꚕ-ꠕ | cm/cm/°C | 导热系数 | 낑.떖 | W/m/K |
| 热固性 | 热固性混合粘度 | 25°C | 떖ꠕ낑낑낑 | cP | Operating Temperature | -ꠕꠕ.낑 到 떖ꠕꠕ | °C | Outgassing | % CVCM | 낑.낑낑낑 | % TMLV | 낑.낑 |
| 机械性能 | 弯曲强度 | . | MPa |
温馨提示：此数据表中的信息由塑胶网从该材料的生产商处获得，塑胶网尽最大努力确保此数据的准确性，但是塑胶网对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。
