SEBS/HB60/EMPILON 物性表
SEBS/HB60/EMPILON
规格用途
该料用途 | 包覆成型; 柔软触感应用 |
备注说明 | EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process. |
技术参数
性能项目 | 测试条件 | 测试方法 | 数值/描述 | 单位 | |
物理性能 | 密度 / 比重 | ASTM D792 | ꥢ.ꥢ | g/cm³ | 熔流率(熔体流动速率) | ASTM D1238 | 200°C/5.0 kg | . | g/10 min | 收缩率 2 | 流动 | ꥢ.ꥢ | % | 横向流动 | ꥢ. | % |
硬度 | 肖氏硬度 | ASTM D2240 | 邵氏 A, 10 秒 | ꈓ줵 | |
弹性体 | 抗张强度 | ASTM D412 | 줰.ꥢ | MPa | 伸长率 | ASTM D412 | 断裂 | ꈓ | % |
热性能 | 脆化温度 | -. | °C | Adhesion to PETG | 内部方法 | . | kgf/25 mm |
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