环氧/Plaskon CMU-870-2A/Cookson Electronics - Semiconductor Products 物性表
环氧/Plaskon CMU-870-2A/Cookson Electronics - Semiconductor Products
规格用途
| 备注说明 | This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package. |
技术参数
| 性能项目 | 测试条件 | 测试方法 | 数值/描述 | 单位 | |
| 物理性能 | 密度 / 比重 | ASTM D792 | ꝉ.앀 | g/cm³ | 收缩率 - 流动 | ASTM D955 | 숐.꜐ | % |
| 可燃性 | UL 阻燃等级 | UL 94 | 3.2 mm | 앁-꜐ | |
| 电气性能 | 体积电阻率 | ASTM D257 | ꘒ.숐臘+ꝉ숐 | ohms·cm | 介电强度 | ASTM D149 | 놆ꝉ | kV/mm | 介电常数 | ASTM D150 | 1 kHz | 놆.ꝉ놆 | 耗散因数 | ASTM D150 | 1 kHz | ꝉ.臘-놆 |
| 机械性能 | 弯曲模量 | ASTM D790 | 22°C | ꝉ. | MPa | 215°C | ꜐.숐앀앀 | MPa | 弯曲强度 | ASTM D790 | 22°C | ꜐.꜐꜐앀놆ꘒ | MPa | 215°C | ꜐.꜐꜐놆ꘒ놆 | MPa |
| 热性能 | 玻璃转化温度 | ASTM E1356 | ꝉ숐 | °C | 线形热膨胀系数 - 流动 | ASTM D696 | ꝉ.臘-숐 | cm/cm/°C | 导热系数 | ASTM C177 | ꜐.숐 | W/m/K |
温馨提示：此数据表中的信息由塑胶网从该材料的生产商处获得，塑胶网尽最大努力确保此数据的准确性，但是塑胶网对这些数据值不承担任何责任，并强烈建议在最终选择材料前，就数据值与材料供应商进行验证。
