搜索结果列表 共搜到关于 165 的物性记录约 20＋条,本页只展示最多20条记录
MMBS|165|INEOS Styrolution
用途：
特性：
备注说明：
Clearblend® 165 is an impact modified styrene acrylic copolymer blend with excellent clarity and outstanding toughness.FEATURES APPLICATIONS
LDPE|LDPE LD 165.BW1|ExxonMobil
备注说明：
ExxonMobil™ LD 165.BW1 resin is a fractional melt index LDPE with medium optical properties.
PVOH|165|Sekisui Chemical Company, Ltd.
用途：
特性：
备注说明：
Selvol™ 165是一种聚乙烯醇 (PVOH)产品。它可以通过涂层进行加工,在北美洲、非洲和中东、拉丁美洲、欧洲或亚太地区有供货。Selvol™ 165的应用领域包括涂覆应用、电影和胶水/胶纸。主要特性为:环保/绿色。
ABS|(ABS) LC 165|A. Schulman Europe
备注说明：
Light colour ABS grade (suitable for self colouring) for injction moulding for injection moulding and extrusion
Cellulose, Regenerated|NP 165|Innovia Films Ltd.
用途：
特性：
备注说明：
NatureFlex™ NP 165是一种Regenerated Cellulose产品。它在北美洲、非洲和中东、拉丁美洲、欧洲或亚太地区有供货。NatureFlex™ NP 165的应用领域包括包袋/内衬、电影和涂覆应用。
TPE|MD-165|Teknor Apex公司
用途：
特性：
备注说明：
Medalist MD-165 is a high performance thermoplastic elastomer specifically designed for healthcare and medical applications. Medalist MD-165 is a high hardness, low density, halogen-free grade that is suitable for injection molding and extrusion.
Cellulose, Regenerated|165 NE|Innovia Films Ltd.
用途：
特性：
备注说明：
NatureFlex™ 165 NE是一种Regenerated Cellulose产品。它在北美洲、非洲和中东、拉丁美洲、欧洲或亚太地区有供货。典型应用领域为:电影。
PVC合金|165|Formosa Plastics Corporation, U.S.A.
用途：
备注说明：
F-165 has been developed primarily to meet the processing requirements of the vinyl composition tile (VCT) manufacturers.In addition to vinyl floor tile industry, F-165 has found success in protective and strippable coatings.
硅酮 (Silicone)|C6-165|Dow Corning Corporation
用途：
特性：
备注说明：
High Consistency Rubber silicone elastomers for device and component fabrication in the healthcare industry.APPLICATIONSDOW CORNING Class VI Elastomers (C6-135, C6-150, C6-165, C6-180) Parts A & B are platinum-catalyzed heat-cure silicone High Consistency Rubbers for part fabrication, extrusion and ...more.
环氧|Plaskon PPF-165|Cookson Electronics - Semiconductor Products
特性：
备注说明：
This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor manufacturing productivity and reduces production costs.
