搜索结果列表 共搜到关于 Compound JF006LXZ - Asia 的物性记录约 20＋条,本页只展示最多20条记录
PES|Compound JF006LXZ - Asia|SABIC
用途：
特性：
备注说明：
LNP THERMOCOMP JF006LXZ is a compound based on Polyethersulfone resin containing 30% Glass Fiber. Added features of this material include: Low Extractible.
PES|Compound JF006LXZ - Americas|SABIC
用途：
特性：
备注说明：
LNP THERMOCOMP JF006LXZ is a compound based on Polyethersulfone resin containing 30% Glass Fiber. Added features of this material include: Low Extractible.
PPS|Compound OX11315 - Asia|SABIC
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特性：
备注说明：
LNP* KONDUIT* OX11315 is a thermally conductive, electrically insulative, mineral filled PPS Flame Retardant compound.
PC|Compound DEL34E - Asia|SABIC
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特性：
备注说明：
LNP LUBRICOMP DEL34 is a compound based on Polycarbonate resin containing PTFE, Carbon Fiber. Added features of this material include: Electrically Conductive.
PPA|Compound UF0067V - Asia|SABIC
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备注说明：
LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications.Additional feature is high heat such that articles made of it can survive SMT process.
ABS|Compound AS003 - Asia|SABIC
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备注说明：
LNP* FARADEX* AS003 is a compound based on ABS resin containing 15% Stainless Steel. Added features of this material include: Electrically Conductive, EMI/RFI Shielding.
PPS|Compound OX10324 - Asia|SABIC
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备注说明：
LNP* KONDUIT* OX10324 is a compound based on PPS resin. Added features of this grade include: Thermally Conductive, Electrically Conductive.
PC|Compound DF008EI - Asia|SABIC
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备注说明：
LNP THERMOTUF DF008EI is a compound based on Polycarbonate resin containing 40% Glass Fiber. Added features of this material include: Easy Molding, Mold Release, High Impact.
PBT|Compound 420C - Asia|SABIC
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备注说明：
LNP* COLORCOMP* 420C is a compound based on PBT resin containing 30% glass. Added features of this grade include: excellent strength, stiffness and dimensional stability, high heat resistance. Good for appliance handles, spotlights, electric motors, connectors.
PC|Compound 241RC - Asia|SABIC
备注说明：
COLORCOMP* 241RC is an unfilled compound based on Polycarbonate resin. Added features include: Flame Retardant, Mold Release.
PC|Compound 141RC - Asia|SABIC
备注说明：
LNP* COLOCROMP* 141RC is a compound based on Polycarbonate. Added features of this grade include: UL rated HB as of 10/97, 200 series recommended when V-2 rating required, 10.5 MFR.
PC|Compound 121C - Asia|SABIC
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备注说明：
LNP* COLORCOMP* 121C is an unfilled compound based on Polycarbonate resin. Added features of this grade include: Non-Halogenated, UL Rated HB. Good for small, intricate parts.
ABS|Compound AF004L - Asia|SABIC
特性：
备注说明：
LNP THERMOCOMP AF004L is a compound based on ABS resin containing 20% Glass Fiber. Added feature of this material is: Low Extractible.
PC|Compound DZ004 - Asia|SABIC
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备注说明：
LNP THERMOCOMP DZ004 is a compound based on Polycarbonate resin containing 20% Milled Glass.
PC|Compound DD0009E - Asia|SABIC
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备注说明：
LNP* STAT-KON* DD0009E is a compound based on Polycarbonate resin containing Carbon Powder. Added features of this material include: Electrically Conductive, Flame Retardant, Easy Molding.
PC|Compound DX02437 - Asia|SABIC
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备注说明：
LNP Stat-Kon DX02437 is a compound based on Polycarbonate resin containing conductive carbon powder, with good impact-resistance, flow and ESD performance, suitable for semi-con industry.
PC|Compound DC006ER - Asia|SABIC
特性：
备注说明：
LNP THERMOCOMP* DC006ER is a compound based on Polycarbonate resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding, Mold Release, Electrically Conductive.
PC|Compound DX15354 - Asia|SABIC
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特性：
备注说明：
LNP* Thermocomp* DX15354 compound is a Polycarbonate (PC) compound with improved heat resistance performance,good plating,surface aesthetics and RF performance that makes it a good candidate for internal and external parts for Laser Direct Structuring (LDS) applications.
PC|Compound DX94375H - Asia|SABIC
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特性：
备注说明：
LNP LUBRICOMP DX94375H is a compound based on Polycarbonate resin containing Proprietary Fillers. Added features of this material include: Healthcare, Wear Resistant.
PSU|Compound GL004 - Asia|SABIC
特性：
备注说明：
LNP* Lubricomp* GL004 is a compound based on Polysulfone resin containing 20% PTFE. Added features of this material include: Internally Lubricated.
